Vulnerability Name:

CVE-2016-2063 (CCN-115990)

Assigned:2016-08-07
Published:2016-08-07
Updated:2020-08-06
Summary:Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
CVSS v3 Severity:7.8 High (CVSS v3.1 Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H)
6.8 Medium (Temporal CVSS v3.1 Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H/E:U/RL:O/RC:C)
Exploitability Metrics:Attack Vector (AV): Local
Attack Complexity (AC): Low
Privileges Required (PR): Low
User Interaction (UI): None
Scope:Scope (S): Unchanged
Impact Metrics:Confidentiality (C): High
Integrity (I): High
Availibility (A): High
9.8 Critical (CCN CVSS v3.1 Vector: CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H)
8.5 High (CCN Temporal CVSS v3.1 Vector: CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H/E:U/RL:O/RC:C)
Exploitability Metrics:Attack Vector (AV): Network
Attack Complexity (AC): Low
Privileges Required (PR): None
User Interaction (UI): None
Scope:Scope (S): Unchanged
Impact Metrics:Confidentiality (C): High
Integrity (I): High
Availibility (A): High
CVSS v2 Severity:4.6 Medium (CVSS v2 Vector: AV:L/AC:L/Au:N/C:P/I:P/A:P)
Exploitability Metrics:Access Vector (AV): Local
Access Complexity (AC): Low
Authentication (Au): None
Impact Metrics:Confidentiality (C): Partial
Integrity (I): Partial
Availibility (A): Partial
10.0 High (CCN CVSS v2 Vector: AV:N/AC:L/Au:N/C:C/I:C/A:C)
Exploitability Metrics:Access Vector (AV): Network
Access Complexity (AC): Low
Athentication (Au): None
Impact Metrics:Confidentiality (C): Complete
Integrity (I): Complete
Availibility (A): Complete
Vulnerability Type:CWE-119
Vulnerability Consequences:Gain Access
References:Source: MITRE
Type: CNA
CVE-2016-2063

Source: BID
Type: Third Party Advisory, VDB Entry
92381

Source: CCN
Type: BID-92381
Linux Kernel 'drivers/thermal/supply_lm_core.c' Stack Buffer Overflow Vulnerability

Source: XF
Type: UNKNOWN
google-android-cve20162063-bo(115990)

Source: CONFIRM
Type: Mailing List, Patch, Third Party Advisory
https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4

Source: CCN
Type: QCIR-2016-00013-1
Stack-Based Buffer Overflow in MSM Thermal Driver Allows Kernel Memory Corruption (CVE-2016-2063)

Source: CONFIRM
Type: Broken Link
https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063

Vulnerable Configuration:Configuration 1:
  • cpe:/o:linux:linux_kernel:*:*:*:*:*:*:*:* (Version >= 3.0 and <= 3.19.8)

    • * Denotes that component is vulnerable
    Oval Definitions
    Definition IDClassTitleLast Modified
    oval:com.ubuntu.precise:def:20162063000
    V
    		CVE-2016-2063 on Ubuntu 12.04 LTS (precise) - medium.
    2016-08-07
    oval:com.ubuntu.trusty:def:20162063000
    V
    		CVE-2016-2063 on Ubuntu 14.04 LTS (trusty) - medium.
    2016-08-07
    oval:com.ubuntu.xenial:def:20162063000
    V
    		CVE-2016-2063 on Ubuntu 16.04 LTS (xenial) - medium.
    2016-08-07
    oval:com.ubuntu.xenial:def:201620630000000
    V
    		CVE-2016-2063 on Ubuntu 16.04 LTS (xenial) - medium.
    2016-08-07
    BACK
    linux linux kernel *