Vulnerability Name:

CVE-2018-11257 (CCN-147791)

Assigned:2018-03-05
Published:2018-03-05
Updated:2019-10-03
Summary:Permissions, Privileges, and Access Controls in TA in Snapdragon Mobile has an options that allows RPMB erase for secure devices in versions SD 210/SD 212/SD 205, SD 845, SD 850.
CVSS v3 Severity:7.8 High (CVSS v3.1 Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H)
6.8 Medium (Temporal CVSS v3.1 Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H/E:U/RL:O/RC:C)
Exploitability Metrics:Attack Vector (AV): Local
Attack Complexity (AC): Low
Privileges Required (PR): Low
User Interaction (UI): None
Scope:Scope (S): Unchanged
Impact Metrics:Confidentiality (C): High
Integrity (I): High
Availibility (A): High
8.4 High (CCN CVSS v3.1 Vector: CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H)
7.3 High (CCN Temporal CVSS v3.1 Vector: CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H/E:U/RL:O/RC:C)
Exploitability Metrics:Attack Vector (AV): Local
Attack Complexity (AC): Low
Privileges Required (PR): None
User Interaction (UI): None
Scope:Scope (S): Unchanged
Impact Metrics:Confidentiality (C): High
Integrity (I): High
Availibility (A): High
CVSS v2 Severity:4.6 Medium (CVSS v2 Vector: AV:L/AC:L/Au:N/C:P/I:P/A:P)
Exploitability Metrics:Access Vector (AV): Local
Access Complexity (AC): Low
Authentication (Au): None
Impact Metrics:Confidentiality (C): Partial
Integrity (I): Partial
Availibility (A): Partial
7.2 High (CCN CVSS v2 Vector: AV:L/AC:L/Au:N/C:C/I:C/A:C)
Exploitability Metrics:Access Vector (AV): Local
Access Complexity (AC): Low
Athentication (Au): None
Impact Metrics:Confidentiality (C): Complete
Integrity (I): Complete
Availibility (A): Complete
Vulnerability Type:CWE-noinfo
Vulnerability Consequences:Gain Privileges
References:Source: MITRE
Type: CNA
CVE-2018-11257

Source: XF
Type: UNKNOWN
qualcomm-cve201811257-priv-esc(147791)

Source: CCN
Type: Qualcomm Web site
Security Bulletins

Source: CONFIRM
Type: Vendor Advisory
https://www.qualcomm.com/company/product-security/bulletins

Vulnerable Configuration:Configuration 1:
  • cpe:/o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:sd_210:-:*:*:*:*:*:*:*

  • Configuration 2:
  • cpe:/o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:sd_212:-:*:*:*:*:*:*:*

  • Configuration 3:
  • cpe:/o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:sd_205:-:*:*:*:*:*:*:*

  • Configuration 4:
  • cpe:/o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:sd_845:-:*:*:*:*:*:*:*

  • Configuration 5:
  • cpe:/o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:sd_850:-:*:*:*:*:*:*:*

  • Configuration CCN 1:
  • cpe:/h:qualcomm:snapdragon_mobile:-:*:*:*:*:*:*:*

  • * Denotes that component is vulnerable
    BACK
    qualcomm sd 210 firmware -
    qualcomm sd 210 -
    qualcomm sd 212 firmware -
    qualcomm sd 212 -
    qualcomm sd 205 firmware -
    qualcomm sd 205 -
    qualcomm sd 845 firmware -
    qualcomm sd 845 -
    qualcomm sd 850 firmware -
    qualcomm sd 850 -
    qualcomm snapdragon mobile -