| Vulnerability Name: | CVE-2019-14015 (CCN-177302) |
| Assigned: | 2019-07-19 |
| Published: | 2019-07-19 |
| Updated: | 2020-03-09 |
| Summary: | A stack-based buffer overflow exists in the initialization of the identification stage due to lack of check on the number of templates provided. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8096, APQ8096AU, MDM9205, MSM8996, MSM8996AU, Nicobar, QCS404, QCS405, QCS605, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130, SXR2130
|
| CVSS v3 Severity: | 7.8 High (CVSS v3.1 Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H)
6.8 Medium (Temporal CVSS v3.1 Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H/E:U/RL:O/RC:C)| Exploitability Metrics: | Attack Vector (AV): Local
Attack Complexity (AC): Low
Privileges Required (PR): Low
User Interaction (UI): None | | Scope: | Scope (S): Unchanged
| | Impact Metrics: | Confidentiality (C): High
Integrity (I): High
Availibility (A): High |
8.4 High (CCN CVSS v3.1 Vector: CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H)
7.3 High (CCN Temporal CVSS v3.1 Vector: CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H/E:U/RL:O/RC:C)| Exploitability Metrics: | Attack Vector (AV): Local
Attack Complexity (AC): Low
Privileges Required (PR): None
User Interaction (UI): None | | Scope: | Scope (S): Unchanged
| | Impact Metrics: | Confidentiality (C): High
Integrity (I): High
Availibility (A): High |
|
| CVSS v2 Severity: | 7.2 High (CVSS v2 Vector: AV:L/AC:L/Au:N/C:C/I:C/A:C)| Exploitability Metrics: | Access Vector (AV): Local
Access Complexity (AC): Low
Authentication (Au): None | | Impact Metrics: | Confidentiality (C): Complete
Integrity (I): Complete
Availibility (A): Complete |
7.2 High (CCN CVSS v2 Vector: AV:L/AC:L/Au:N/C:C/I:C/A:C)| Exploitability Metrics: | Access Vector (AV): Local
Access Complexity (AC): Low
Athentication (Au): None
| | Impact Metrics: | Confidentiality (C): Complete
Integrity (I): Complete
Availibility (A): Complete |
|
| Vulnerability Type: | CWE-787
|
| Vulnerability Consequences: | Gain Access |
| References: | Source: MITRE
Type: CNA
CVE-2019-14015
Source: XF
Type: UNKNOWN
qualcomm-cve201914015-bo(177302)
Source: CCN
Type: Qualcomm Web site
March 2020 Security Bulletin
Source: CONFIRM
Type: Vendor Advisory
https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin
|
| Vulnerable Configuration: | Configuration 1:
cpe:/o:qualcomm:apq8096_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:apq8096:-:*:*:*:*:*:*:*
Configuration 2:
cpe:/o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:apq8096au:-:*:*:*:*:*:*:*
Configuration 3:
cpe:/o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:mdm9205:-:*:*:*:*:*:*:*
Configuration 4:
cpe:/o:qualcomm:msm8996_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:msm8996:-:*:*:*:*:*:*:*
Configuration 5:
cpe:/o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:msm8996au:-:*:*:*:*:*:*:*
Configuration 6:
cpe:/o:qualcomm:nicobar_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:nicobar:-:*:*:*:*:*:*:*
Configuration 7:
cpe:/o:qualcomm:qcs404_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:qcs404:-:*:*:*:*:*:*:*
Configuration 8:
cpe:/o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:qcs405:-:*:*:*:*:*:*:*
Configuration 9:
cpe:/o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:qcs605:-:*:*:*:*:*:*:*
Configuration 10:
cpe:/o:qualcomm:rennell_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:rennell:-:*:*:*:*:*:*:*
Configuration 11:
cpe:/o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sa6155p:-:*:*:*:*:*:*:*
Configuration 12:
cpe:/o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sc8180x:-:*:*:*:*:*:*:*
Configuration 13:
cpe:/o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sda660:-:*:*:*:*:*:*:*
Configuration 14:
cpe:/o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sda845:-:*:*:*:*:*:*:*
Configuration 15:
cpe:/o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sdm630:-:*:*:*:*:*:*:*
Configuration 16:
cpe:/o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sdm636:-:*:*:*:*:*:*:*
Configuration 17:
cpe:/o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sdm660:-:*:*:*:*:*:*:*
Configuration 18:
cpe:/o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sdm670:-:*:*:*:*:*:*:*
Configuration 19:
cpe:/o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sdm710:-:*:*:*:*:*:*:*
Configuration 20:
cpe:/o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sdm845:-:*:*:*:*:*:*:*
Configuration 21:
cpe:/o:qualcomm:sdm850_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sdm850:-:*:*:*:*:*:*:*
Configuration 22:
cpe:/o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sdx24:-:*:*:*:*:*:*:*
Configuration 23:
cpe:/o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sdx55:-:*:*:*:*:*:*:*
Configuration 24:
cpe:/o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sm6150:-:*:*:*:*:*:*:*
Configuration 25:
cpe:/o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sm7150:-:*:*:*:*:*:*:*
Configuration 26:
cpe:/o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sm8150:-:*:*:*:*:*:*:*
Configuration 27:
cpe:/o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sxr1130:-:*:*:*:*:*:*:*
Configuration 28:
cpe:/o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*AND cpe:/h:qualcomm:sxr2130:-:*:*:*:*:*:*:*
Configuration CCN 1:
cpe:/h:qualcomm:snapdragon_mobile:-:*:*:*:*:*:*:*OR cpe:/h:qualcomm:snapdragon_auto:-:*:*:*:*:*:*:*OR cpe:/h:qualcomm:snapdragon_compute:-:*:*:*:*:*:*:*OR cpe:/h:qualcomm:snapdragon_connectivity:-:*:*:*:*:*:*:*OR cpe:/h:qualcomm:snapdragon_consumer_internet_of_things:-:*:*:*:*:*:*:*OR cpe:/h:qualcomm:snapdragon_industrial_internet_of_things:-:*:*:*:*:*:*:*OR cpe:/h:qualcomm:snapdragon_voice_&_music:-:*:*:*:*:*:*:*OR cpe:/o:qualcomm:snapdragon_wired_infrastructure_&_networking:-:*:*:*:*:*:*:*
 Denotes that component is vulnerable |
| BACK |
qualcomm apq8096 firmware -
qualcomm apq8096 -
qualcomm apq8096au firmware -
qualcomm apq8096au -
qualcomm mdm9205 firmware -
qualcomm mdm9205 -
qualcomm msm8996 firmware -
qualcomm msm8996 -
qualcomm msm8996au firmware -
qualcomm msm8996au -
qualcomm nicobar firmware -
qualcomm nicobar -
qualcomm qcs404 firmware -
qualcomm qcs404 -
qualcomm qcs405 firmware -
qualcomm qcs405 -
qualcomm qcs605 firmware -
qualcomm qcs605 -
qualcomm rennell firmware -
qualcomm rennell -
qualcomm sa6155p firmware -
qualcomm sa6155p -
qualcomm sc8180x firmware -
qualcomm sc8180x -
qualcomm sda660 firmware -
qualcomm sda660 -
qualcomm sda845 firmware -
qualcomm sda845 -
qualcomm sdm630 firmware -
qualcomm sdm630 -
qualcomm sdm636 firmware -
qualcomm sdm636 -
qualcomm sdm660 firmware -
qualcomm sdm660 -
qualcomm sdm670 firmware -
qualcomm sdm670 -
qualcomm sdm710 firmware -
qualcomm sdm710 -
qualcomm sdm845 firmware -
qualcomm sdm845 -
qualcomm sdm850 firmware -
qualcomm sdm850 -
qualcomm sdx24 firmware -
qualcomm sdx24 -
qualcomm sdx55 firmware -
qualcomm sdx55 -
qualcomm sm6150 firmware -
qualcomm sm6150 -
qualcomm sm7150 firmware -
qualcomm sm7150 -
qualcomm sm8150 firmware -
qualcomm sm8150 -
qualcomm sxr1130 firmware -
qualcomm sxr1130 -
qualcomm sxr2130 firmware -
qualcomm sxr2130 -
qualcomm snapdragon mobile -
qualcomm snapdragon auto -
qualcomm snapdragon compute -
qualcomm snapdragon connectivity -
qualcomm snapdragon consumer internet of things -
qualcomm snapdragon industrial internet of things -
qualcomm snapdragon voice & music -
qualcomm snapdragon wired infrastructure & networking -