Vulnerability Name:

CVE-2019-14030 (CCN-177261)

Assigned:2019-07-19
Published:2019-07-19
Updated:2020-03-05
Summary:The size of a buffer is determined by addition and multiplications operations that have the potential to overflow due to lack of bound check in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, QCS404, Rennell, SC8180X, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR2130
CVSS v3 Severity:7.8 High (CVSS v3.1 Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H)
6.8 Medium (Temporal CVSS v3.1 Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H/E:U/RL:O/RC:C)
Exploitability Metrics:Attack Vector (AV): Local
Attack Complexity (AC): Low
Privileges Required (PR): Low
User Interaction (UI): None
Scope:Scope (S): Unchanged
Impact Metrics:Confidentiality (C): High
Integrity (I): High
Availibility (A): High
8.4 High (CCN CVSS v3.1 Vector: CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H)
7.3 High (CCN Temporal CVSS v3.1 Vector: CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H/E:U/RL:O/RC:C)
Exploitability Metrics:Attack Vector (AV): Local
Attack Complexity (AC): Low
Privileges Required (PR): None
User Interaction (UI): None
Scope:Scope (S): Unchanged
Impact Metrics:Confidentiality (C): High
Integrity (I): High
Availibility (A): High
CVSS v2 Severity:7.2 High (CVSS v2 Vector: AV:L/AC:L/Au:N/C:C/I:C/A:C)
Exploitability Metrics:Access Vector (AV): Local
Access Complexity (AC): Low
Authentication (Au): None
Impact Metrics:Confidentiality (C): Complete
Integrity (I): Complete
Availibility (A): Complete
7.2 High (CCN CVSS v2 Vector: AV:L/AC:L/Au:N/C:C/I:C/A:C)
Exploitability Metrics:Access Vector (AV): Local
Access Complexity (AC): Low
Athentication (Au): None
Impact Metrics:Confidentiality (C): Complete
Integrity (I): Complete
Availibility (A): Complete
Vulnerability Type:CWE-120
Vulnerability Consequences:Gain Access
References:Source: MITRE
Type: CNA
CVE-2019-14030

Source: XF
Type: UNKNOWN
qualcomm-cve201914030-bo(177261)

Source: CCN
Type: Qualcomm Web site
March 2020 Security Bulletin

Source: CONFIRM
Type: Vendor Advisory
https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin

Vulnerable Configuration:Configuration 1:
  • cpe:/o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:mdm9205:-:*:*:*:*:*:*:*

    • Configuration 2:
  • cpe:/o:qualcomm:qcs404_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:qcs404:-:*:*:*:*:*:*:*

    • Configuration 3:
  • cpe:/o:qualcomm:rennell_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:rennell:-:*:*:*:*:*:*:*

    • Configuration 4:
  • cpe:/o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:sc8180x:-:*:*:*:*:*:*:*

    • Configuration 5:
  • cpe:/o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:sdm845:-:*:*:*:*:*:*:*

    • Configuration 6:
  • cpe:/o:qualcomm:sdm850_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:sdm850:-:*:*:*:*:*:*:*

    • Configuration 7:
  • cpe:/o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:sdx55:-:*:*:*:*:*:*:*

    • Configuration 8:
  • cpe:/o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:sm6150:-:*:*:*:*:*:*:*

    • Configuration 9:
  • cpe:/o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:sm7150:-:*:*:*:*:*:*:*

    • Configuration 10:
  • cpe:/o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:sm8150:-:*:*:*:*:*:*:*

    • Configuration 11:
  • cpe:/o:qualcomm:sm8250_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:sm8250:-:*:*:*:*:*:*:*

    • Configuration 12:
  • cpe:/o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*
  • AND
  • cpe:/h:qualcomm:sxr2130:-:*:*:*:*:*:*:*

    • Configuration CCN 1:
  • cpe:/h:qualcomm:snapdragon_mobile:-:*:*:*:*:*:*:*
  • OR cpe:/h:qualcomm:snapdragon_auto:-:*:*:*:*:*:*:*
  • OR cpe:/h:qualcomm:snapdragon_compute:-:*:*:*:*:*:*:*
  • OR cpe:/h:qualcomm:snapdragon_consumer_internet_of_things:-:*:*:*:*:*:*:*
  • OR cpe:/h:qualcomm:snapdragon_industrial_internet_of_things:-:*:*:*:*:*:*:*
  • OR cpe:/o:qualcomm:snapdragon_wired_infrastructure_&_networking:-:*:*:*:*:*:*:*

    • * Denotes that component is vulnerable
    BACK
    qualcomm mdm9205 firmware -
    qualcomm mdm9205 -
    qualcomm qcs404 firmware -
    qualcomm qcs404 -
    qualcomm rennell firmware -
    qualcomm rennell -
    qualcomm sc8180x firmware -
    qualcomm sc8180x -
    qualcomm sdm845 firmware -
    qualcomm sdm845 -
    qualcomm sdm850 firmware -
    qualcomm sdm850 -
    qualcomm sdx55 firmware -
    qualcomm sdx55 -
    qualcomm sm6150 firmware -
    qualcomm sm6150 -
    qualcomm sm7150 firmware -
    qualcomm sm7150 -
    qualcomm sm8150 firmware -
    qualcomm sm8150 -
    qualcomm sm8250 firmware -
    qualcomm sm8250 -
    qualcomm sxr2130 firmware -
    qualcomm sxr2130 -
    qualcomm snapdragon mobile -
    qualcomm snapdragon auto -
    qualcomm snapdragon compute -
    qualcomm snapdragon consumer internet of things -
    qualcomm snapdragon industrial internet of things -
    qualcomm snapdragon wired infrastructure & networking -